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filingDate 2001-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2002-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002353632-A
titleOfInvention Wiring board and method of manufacturing the same
abstract [PROBLEMS] To provide a wiring board capable of extremely high-density wiring without disconnection of a through conductor even if the diameter of a through hole is as small as about 75 to 130 μm, and a method of manufacturing the same. thing. SOLUTION: The upper and lower surfaces of a double-sided copper-clad plate in which inner layer conductors 2A and 2B made of copper foil are adhered to the upper and lower surfaces of an insulating resin plate 1 have a greater degree of decomposition by laser light irradiation than the insulating resin plate 1. A plurality of through-holes 4 having resin layers 3A and 3B attached thereto, penetrating vertically through the double-sided copper-clad board and insulating resin layers 3A and 3B, and expanding outward in insulating resin layers 3A and 3B. Is formed by laser processing, The through conductor 5 and the insulating resin layer 3A Surface conductors 6A and 6B are formed on the surface of 3B by plating.
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