http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002348469-A

Outgoing Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
filingDate 2001-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_644e9ea0458127d65d24b8648acd3524
publicationDate 2002-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002348469-A
titleOfInvention Heat resistant resin composition, prepreg and laminate using the same
abstract An object of the present invention is to provide a resin composition excellent in heat resistance, dielectric properties, and water absorption, a prepreg, and a laminate obtained from the prepreg. The heat-resistant resin composition contains a cyanate resin, an aralkyl-modified epoxy resin, and an aralkyl resin as essential components.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005056632-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009119046-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5589835-B2
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priorityDate 2001-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 30.