http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002344114-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| filingDate | 2001-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8b87bc995ff470de3deee11a171a46c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95eebf73dcd182ed073d4dbbf7dd20b6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d76c7f825257fa8cdb08ab406f39ae16 |
| publicationDate | 2002-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002344114-A |
| titleOfInvention | Wiring board and manufacturing method thereof |
| abstract | (57) [Problem] To form a concave portion of a wiring pattern shape, Provided is a wiring board in which a non-reinforcement resin portion is hardly generated and a problem due to a partial decrease in strength is hardly generated, and a method for manufacturing the same. SOLUTION: An upper mold C and a lower mold D in which different wiring patterns are respectively formed in a convex shape are arranged on both surfaces of a resin substrate 11 in a prepreg state in which a conductive paste 13 is filled in a through hole 12. By applying heat and pressure from both sides, the resin substrate 11 is cured and, at the same time, a concave portion 15 having a wiring pattern shape is formed on both surfaces of the cured resin substrate 14, and a wiring pattern conductor 16 such as a conductive paste is formed on the concave portion 15. In the manufacturing method of filling and flattening the surface of the resin substrate 14 and the surface of the wiring pattern conductor 16, a porous film of a heat-resistant resin is used as a reinforcing material of the resin substrate 11. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009236721-A |
| priorityDate | 2001-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.