| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S438-974
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67739 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67167
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28556
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67201
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76888
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76882
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67017 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-677 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate |
2002-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35b2c355eee8b9d4c07e1f15d234ca6a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbbdffe28d175e2af337664b53d67143
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a346b0ffdc2f5329eddb3bb461886e4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae7521b932228bfd878e904e376ba4b7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecbd7fa115f0f892a4ab6782a2735208 |
| publicationDate |
2002-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002343863-A |
| titleOfInvention |
Wafer processing apparatus and wafer processing method using the same |
| abstract |
PROBLEM TO BE SOLVED: To provide an integrated in-situ cluster tool type wafer processing apparatus used for forming a metal wiring having a multilayer wiring structure and a wafer processing method using the same. SOLUTION: The wafer processing apparatus includes a transfer chamber 10 which is evacuated and has a plurality of gate valves, and a plurality of vacuum processing chambers 20 each of which can communicate with the transfer chamber through one of the plurality of gate valves. 30 and 40, and a load lock chamber 50 capable of being evacuated and connected to a first gas supply line for supplying an oxygen-containing gas therein. In the wafer processing method, a predetermined film is formed on a wafer in one of a plurality of vacuum processing chambers. A predetermined film on the wafer is oxidized in the load lock chamber. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008153609-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009507135-A |
| priorityDate |
2001-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |