http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002343240-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J9-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 |
filingDate | 2001-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4855af7ac62fc508be055f6458a56619 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25939ebc71d1dea565f3a31e8542ce6f |
publicationDate | 2002-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2002343240-A |
titleOfInvention | Active energy ray-curable resin composition for back coat and method for producing shadow mask using the same |
abstract | (57) Abstract: An active energy ray-curable resin composition for a back coat capable of forming a high-strength back coat film to achieve improved quality and efficient production of a shadow mask, and a shadow mask using the same. A manufacturing method is provided. SOLUTION: By using a curable resin composition containing a compound having one or more acid groups and two or more acryloyl groups or methacryloyl groups in one molecule, a high strength resin having a three-dimensional network structure is obtained. The above problem was solved by facilitating the formation of the back coat film and preventing foreign substances from adhering to the portion to be etched even when the secondary etching temperature after the formation of the back coat film was increased. In the method of manufacturing the shadow mask, the quality improvement and efficient manufacturing of the shadow mask 1 were achieved by forming the back coat film 8 using the curable resin composition containing the above compound. |
priorityDate | 2001-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 99.