http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002338938-A

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Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2f8cfa5aee4410611b5c562275c9f8e3
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G09F3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
filingDate 2001-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_435bb6d86265c12e0dc17c926e0cac25
publicationDate 2002-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002338938-A
titleOfInvention Heat-sensitive adhesive composition, heat-sensitive adhesive, heat-sensitive adhesive laminate using the same, and method for producing the same
abstract (57) [Problem] When a heat-sensitive adhesive is coated on a substrate to produce a heat-sensitive adhesive laminate, high adhesiveness can be maintained for a long time, Moreover, to provide a heat-sensitive adhesive composition and a heat-sensitive adhesive having excellent blocking resistance, and furthermore, the product has high productivity, excellent adhesiveness and excellent transparency, and can be stored for a long time. To provide a heat-sensitive adhesive laminate which does not cause blocking and a method for producing the same. SOLUTION: Thermoplastic resin (A) and solid plasticizer (B) A bis (polyalkylcyclohexyl) phthalate (B1) having a melting point of less than 100 ° C. as the solid plasticizer (B); The present invention provides a heat-sensitive adhesive composition, a heat-sensitive adhesive, a heat-sensitive adhesive laminate using the same, and a method for producing the same, which are used in combination with a compound (B2) having a temperature of at least 0 ° C.
priorityDate 2001-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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