Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b3310ea86f3c492f6c09d7be6592866d |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4626 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-315 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-901 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-315 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
filingDate |
2001-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0eeb6ef243659ac20e6ba8f530400f99 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_117e3a8d3ba203fcb1473933bce6f080 |
publicationDate |
2002-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2002338786-A |
titleOfInvention |
Cyanate ester-containing insulating composition, insulating film manufactured therefrom, and multilayer printed circuit board provided with the insulating film |
abstract |
PROBLEM TO BE SOLVED: To provide a cyanate ester-containing insulating composition having improved heat resistance, an insulating film produced therefrom, and a multilayer printed circuit board provided with the insulating film. SOLUTION: An insulating composition comprising 1 to 75% by weight of an epoxy resin, 1 to 60% by weight of a cyanate ester resin, up to 20% by weight of a filler, a curing agent and a metal catalyst, and an insulating film produced therefrom And a multilayer printed circuit board comprising an insulating film. By using both an epoxy resin with excellent electrical properties and a cyanate ester resin with high heat resistance, a net structure is formed by the reaction of a part of the epoxy group with the hydroxy group of the epoxy resin. The heat resistance of a product, an insulating film manufactured using the same, and a multilayer printed circuit board including the same is improved. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104312147-A |
priorityDate |
2001-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |