http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002336987-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-03
filingDate 2001-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af69f08b4d7f10c37014b5cea69debd4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3db629bf8fc4c901ca67d4ab99fde93f
publicationDate 2002-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002336987-A
titleOfInvention Laser processing method
abstract (57) [Summary] [PROBLEMS] To realize high-precision processing management in multi-axis laser processing. SOLUTION: Each processing shaft 6 of a plurality of laser processing apparatuses 1 The same processing is performed on the workpieces 5a and 5b at a and 6b. An apparatus identification mark 31 indicating which laser processing apparatus 1 has processed the workpiece and a processing axis determination mark 32 indicating which processing axis 6a or 6b has been processed by the laser. Workpieces 5a, 5b. Workpiece 5 based on the recognized image a, 5b are inspected and the device identification mark 3 1 and the workpiece 5 based on the machining axis discrimination mark 32 Laser processing apparatus 1 and processing shaft 6 in which a and 5b are processed a and 6b are determined, and processing conditions in each laser processing apparatus 1 are managed.
priorityDate 2001-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419499693
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3033151

Total number of triples: 16.