| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0e433c1625fc509a087c912b440da84b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7688
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2002-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09cb229f8e14e1351852b77533b2b079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a36b9d92343d9903a6af53330bf2c0b7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43482adf579675b55662390605365f38 |
| publicationDate |
2002-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002334926-A |
| titleOfInvention |
Use of a sacrificial layer to facilitate metallization for microstructures |
| abstract |
(57) [Problem] To provide a method of manufacturing a copper wiring using a sacrificial layer. SOLUTION: An SiC layer (106) is formed on a dielectric layer (102). A sacrificial layer (108) is formed on the SiC layer (106). Sacrificial layer (108), SiC Grooves (112) are formed in layer (106) and dielectric layer (102) by etching. Sacrificial layer (108) Is sputter-etched to form a dielectric layer (10 An opening wider than the upper part of 2) is formed on the sacrificial layer (108). A barrier layer (114) and a copper seed layer (116) are formed. The trench (112) is filled with copper (124). C Using MP, extra copper (124) and barrier layer (114) Is removed and fixed on SiC (106). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007043100-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012064713-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2007043100-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005538544-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006351899-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4549937-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101336962-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013258408-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012510164-A |
| priorityDate |
2001-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |