http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002334645-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-01 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01H59-0009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H59-00 |
filingDate | 2002-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ad62babc24d64d5f8d03077e685d016 |
publicationDate | 2002-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2002334645-A |
titleOfInvention | MEMS relay and method of manufacturing the same |
abstract | (57) Abstract: A MEMS relay and a method for manufacturing the same are provided. A first wafer has a drive electrode located on a lower surface thereof, and a first electrode on an input signal electrode and an output signal electrode adjacent to the drive electrode on the surface thereof. The second wafer includes a via hole penetrating the wafer and a metal pad formed on the via hole, and the second wafer has a body formed with a sealing portion for sealing between the first and third wafers at an edge thereof. A silicon substrate and a passivation layer formed on the silicon substrate and a contact electrode formed on both sides of the silicon substrate and facing the signal electrode are formed integrally with the silicon substrate, and a predetermined distance downward from the upper surface of the body. A third driving unit that includes a driving body that is located at a distance and a connection supporting part that extends outward from opposite sides of the driving body and is connected to the inside of the body so that the driving body is supported in the second wafer; Is characterized by having a cavity in which the driving body can rotate. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007533105-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009107041-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-1309015-C http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7816999-B2 |
priorityDate | 2001-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.