http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002332322-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_585ee4d9a14c5df01e545ffc2ea93612 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2002-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7bdbe482015c616275bb49345fac9b43 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_80874db238cc2bdc196087d66f4fa7f0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_034f2abf6e24ac9e608b4165cd186b06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df36366e23750de671341e0ca3474fe2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_958fa6a78df15339b2fc8f75a16c6d6a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76053cb7ec1ddf5503b9e75495f47fa0 |
| publicationDate | 2002-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002332322-A |
| titleOfInvention | Molding material, material for electric / electronic parts, and semiconductor encapsulant containing highly reactive modified phenolic resin and epoxy resin |
| abstract | (57) [Summary] A heavy oil or a pitch as a feed oil and one mole of the feed oil calculated from the average molecular weight are used in an amount of 0. 3 to 10 moles of phenol, equivalent to formaldehyde 2-9 moles of formaldehyde compound, and 0.01-3. A modified phenolic resin molding material containing an epoxy resin and a highly reactive modified phenolic resin obtained by a production method in which 0 mol of an acid catalyst is mixed, heated and stirred to carry out polycondensation of the above components. The modified phenolic resin molding material according to the present invention uses a highly reactive modified phenolic resin having a low melt viscosity and a high reactivity with an epoxy resin, so that it has good moldability, dimensional stability, It is excellent in heat resistance and the like, has low moisture absorption, and is useful as a material for electric / electronic parts and a semiconductor sealing material. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102066814-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190086638-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014019678-A |
| priorityDate | 1997-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 174.