http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002329960-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G04G19-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G04G19-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate | 2001-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf280996a35d34db05b4f5e383fc4dbe |
| publicationDate | 2002-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002329960-A |
| titleOfInvention | Wiring board |
| abstract | (57) [Abstract] (with correction) [PROBLEMS] To provide an excellent productivity that can effectively prevent peeling of a thick film wiring layer from an underlayer and breakage of the underlayer of a thick film wiring layer. A wiring board is provided. A wiring board comprising a substrate and a plurality of thick film wiring layers made of a conductive material disposed on a substrate, wherein a porous metal having pores therein is disposed between the substrate and the thick film wiring layer. And a buffer layer 2 made of a resin material 2b having a Shore hardness of 20 to 150 and partially impregnated in the porous metal 2a. The porosity of the porous metal 2a is set to 90% to 98%. |
| priorityDate | 2001-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.