http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002327105-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5399 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34 |
| filingDate | 2001-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2966cd4714a8deeee873ec64b22cd2d |
| publicationDate | 2002-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002327105-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound and is excellent in moldability, flame retardancy, high-temperature storage characteristics, moisture resistance reliability, and solder crack resistance. provide. SOLUTION: An epoxy resin, a phenol resin, a curing accelerator, an inorganic filler, a phosphazene compound, aluminum hydroxide, and at least one selected from compounds represented by the general formulas (1) and (2) are essential components. Epoxy resin composition for semiconductor encapsulation. BiO a (OH) b (NO 3 ) c (1) (where a = 0.9 to 1.1, b = 0.6 to 0.8, c = 0-0.4) BiO a (OH) b (NO 3 ) c (HSiO 3 ) d (2) (where a = 0.9-1.1, b = 0.6-0.8, c + D = 0.2-0.4) |
| priorityDate | 2001-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 57.