http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002323535-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
filingDate 2001-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d89c3f67b2460bcd8bf30b4ec23474d2
publicationDate 2002-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002323535-A
titleOfInvention Inspection method for semiconductor device
abstract PROBLEM TO BE SOLVED: To provide a method for electrically connecting a semiconductor element and a wiring board by sharply extruding an aluminum film of an electrode because a tip of a probe needle is largely pushed forward with respect to a needle base. When a bump (protruding electrode) is formed on an electrode of a semiconductor element, a contact mark formed by a probe needle causes The bonding strength between the bump and the electrode of the semiconductor element decreases. SOLUTION: The probe needle is brought into contact with the electrode of the semiconductor element, and the electrical characteristics of the semiconductor element are determined in a state where the angle formed between the electrode of the semiconductor element and the tip of the probe needle in contact with the electrode of the semiconductor element is larger than 90 degrees. Is determined.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105467174-A
priorityDate 2001-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268

Total number of triples: 15.