http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002323535-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
filingDate | 2001-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d89c3f67b2460bcd8bf30b4ec23474d2 |
publicationDate | 2002-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2002323535-A |
titleOfInvention | Inspection method for semiconductor device |
abstract | PROBLEM TO BE SOLVED: To provide a method for electrically connecting a semiconductor element and a wiring board by sharply extruding an aluminum film of an electrode because a tip of a probe needle is largely pushed forward with respect to a needle base. When a bump (protruding electrode) is formed on an electrode of a semiconductor element, a contact mark formed by a probe needle causes The bonding strength between the bump and the electrode of the semiconductor element decreases. SOLUTION: The probe needle is brought into contact with the electrode of the semiconductor element, and the electrical characteristics of the semiconductor element are determined in a state where the angle formed between the electrode of the semiconductor element and the tip of the probe needle in contact with the electrode of the semiconductor element is larger than 90 degrees. Is determined. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105467174-A |
priorityDate | 2001-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Predicate | Subject |
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isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268 |
Total number of triples: 15.