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filingDate 2001-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e50e3344771e29836966abc5c9e3cb7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef373f7864f9d9e404eed19ebd626d1d
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publicationDate 2002-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002322456-A
titleOfInvention Anisotropic conductive paste
abstract (57) [Problem] In a conventional anisotropic conductive paste, there is a problem that it is difficult to secure insulation between adjacent electrodes with the recent increase in the density of electronic circuits. In addition, with the miniaturization of the electrode connection portion, there is a problem that it is difficult to obtain predetermined electrical conduction. An object of the present invention is to provide an anisotropic conductive paste that solves the above-mentioned problems in anisotropic electrical connection of electronic components and that does not cause a decrease in insulation between adjacent electrodes and facilitates electrical conduction at electrode connection portions. An anisotropic conductive paste comprising a thermosetting resin and a large number of conductive particles, wherein the conductive particles are 2 An anisotropic conductive paste having at least one kind of particle diameter, wherein the conductive particles having at least one kind of particle diameter are conductive ultrafine particles having a particle diameter of 30 nm or less.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108475583-A
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