http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002322346-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2001-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a13f37237a5dc91012443f97652d2033 |
| publicationDate | 2002-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002322346-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | [PROBLEMS] To provide an epoxy resin composition for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound and has excellent properties such as fluidity, moldability such as releasability, and solder crack resistance. To provide. SOLUTION: The roundness of (A) epoxy resin, (B) phenolic resin, (C) curing accelerator, (D) inorganic filler and (E) silane coupling agent previously treated with a roundness of 0.4 to less. An epoxy resin composition for encapsulating a semiconductor, comprising 1.0 aluminum hydroxide. |
| priorityDate | 2001-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.