http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002319605-A

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filingDate 2001-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2002-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002319605-A
titleOfInvention Inspection method for semiconductor device
abstract (57) [Summary] [Problem] In a probe inspection process, there is a problem that the frequency of cleaning of the probe is increased and the throughput in the entire inspection process is decreased because grown foreign matter of the bump adheres to the probe. SOLUTION: The tip 12a of the probe 12 has an acute angle and a spherical shape, so that the tip 12a of the probe 12 can be brought into contact with the Au bump electrode 11 without an overdrive amount in the inspection step. Throughput can be reduced as an inspection method by reducing the amount of foreign matter adhering to bumps on the needle 12 and cleaning the probe with a cleaning sheet that can reliably remove foreign matter adhering to the probe. And an excellent method for inspecting a semiconductor device which can reduce the inspection cost can be realized.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101517065-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009156796-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011058927-A
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Total number of triples: 21.