| abstract |
PROBLEM TO BE SOLVED: To provide a catalyst composition suitable for depositing an electroless metal seed layer and enhancing a discontinuous seed layer, and a method for depositing an electroless seed layer. A method for enhancing a continuous seed layer is provided. SOLUTION: 1 μm including one or more metal salts, one or more copper complexing agents, one or more organic binders, one or more reducing agents and a base. Compositions and methods suitable for depositing electroless plating catalysts on substrates having openings of less than m. |