| abstract |
(57) [Problem] To provide an adhesive film excellent in adhesive strength and heat resistance (particularly, solder heat resistance), and excellent in dimensional stability and strength. A heat-resistant film, and an adhesive film provided with an adhesive layer made of a resin containing thermoplastic polyimide as a main component, wherein the heat-resistant film has a water absorption of less than 1.0%; An adhesive film is provided, wherein the adhesive strength between the heat-resistant film and the adhesive layer is 0.8 kg / cm or more. The above heat-resistant bonding method, which comprises a step of performing a far-infrared treatment on the heat-resistant film at an atmosphere temperature of 450 ° C. to 550 ° C. and / or a step of performing a plasma treatment on the surface of the heat-resistant film in an atmosphere containing nitrogen gas. A method of making a film is also provided. |