abstract |
(57) [Summary] [PROBLEMS] To provide excellent photosensitivity, flexibility of cured product, solder heat resistance, Provided is a resin composition which is excellent in heat deterioration resistance and electroless gold plating resistance, can be developed with an organic solvent or a dilute alkali solution, and is suitable for a solder resist and an interlayer insulating layer. A polyimide precursor (a) having a terminal anhydride group represented by the general formula (1): (Wherein, R 1 represents a tetravalent organic group having 2 to 30 carbon atoms, R 2 represents a divalent organic group having 2 to 240 carbon atoms, and n is an integer of 0 or 1 or more. ), A hydroxyl group-containing maleimide compound (b), and an optional component, a oligomer compound (A) obtained by reacting a polyol compound (c) with a diluent (B). |