| abstract |
(57) [Problem] To provide a flip chip mounting method which does not generate a void between a semiconductor chip and a substrate. SOLUTION: In the flip chip mounting method, (A) a step of drying the substrate; and (B) (1), Any of (2), that is: (1) a portion of the substrate surface to which at least the bumps are pressed on the substrate surface, And / or dispensing over the entire area of the substrate where fine irregularities are present; (2) the temperature difference between the semiconductor chip and the substrate substantially causes convection in the uncured or curable sealant. Performing a pressure bonding and curing of a sealant while maintaining a temperature condition so as to prevent the mounting. |