| abstract |
PROBLEM TO BE SOLVED: To provide a stud bump provided on a semiconductor chip without a tail, having a large connection area for mounting, and obtaining sufficient connection strength without increasing the cost of a mounting board or the like. Provided are a semiconductor device and a method for manufacturing the same. SOLUTION: A stud bump 14 is provided on an electrode pad 13 provided on the surface of a semiconductor chip 12, and the stud bump 14 has a short columnar root portion 15 formed with a small diameter, and the root portion 15. And a short cylindrical tip portion 16 formed with a larger diameter. 6 are flat surfaces, and the stud bumps 14 are formed by bonding gold alloy wires to a quartz glass transparent flat plate transfer substrate to form convex studs, and then on the aluminum electrode pads 13. Thermocompression bonding is performed so as to transfer, and is formed to have an inverted convex shape. |