| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
2001-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ded06b4da6470e3a927c571e5e7ce35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2f1465a1468f1f7b561465ad7bfd07d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abe944950da177d0b2c067ab7f03455b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16fbd1e490c6baa2adaf46429717672f |
| publicationDate |
2002-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002313825-A |
| titleOfInvention |
Bare chip mounting method and bare chip processing device |
| abstract |
(57) Abstract: A bare chip mounting method capable of improving the adhesion between a semiconductor substrate surface of a bare chip and a coated resin is provided. In the bare chip mounting method of the present invention, A non-contact cleaning process is performed on the semiconductor substrate surface 43 of the bare chip 42 surface-mounted on the substrate 40, and a resin coating process 46 is performed on at least the semiconductor substrate surface 43 of the bare chip 42 continuously with the non-contact cleaning process. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017143131-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013021021-A |
| priorityDate |
2001-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |