http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002305219-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c5520dd38cc403678d9f91e0b0ee95fb |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2001-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bfbcf36f8be481d88c33dcaac2c2aeba |
| publicationDate | 2002-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002305219-A |
| titleOfInvention | Tape carrier package semiconductor device and method of manufacturing the same |
| abstract | PROBLEM TO BE SOLVED: To provide a low-cost tape carrier package semiconductor device in which operation failure due to contact between an end of a semiconductor element and a wiring pattern is prevented, and a method for manufacturing the same. SOLUTION: A tape carrier 7 in which a metal wiring pattern 5 is formed on an insulating film 4 is arranged so as to face the tape carrier 7 and an outer periphery 8 of the facing surface. A semiconductor element 1 having an aluminum pad 2 at a more inner position, wherein the bonding portion 10 of the metal wiring pattern 5 is bonded to the aluminum pad 2 via the gold bump 3 in a tape carrier package semiconductor device. 0, the thickness of the bonding portion 10 is increased in the peripheral portion of the extended portion 11 of the metal wiring pattern 5 extending from the region overlapping with the facing surface of the semiconductor device 1 to the outer portion 8 of the semiconductor device 1. Thin portion 11a having a thickness T2 smaller than T1 To form |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007214601-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4572348-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8136238-B2 |
| priorityDate | 2001-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.