abstract |
(57) [Abstract] [Problem] Non-halogen and non-antimony, moldability, Epoxy resin material for sealing with good flame retardancy without reducing reliability such as reflow resistance, moisture resistance, and high temperature storage characteristics, And an electronic component device provided with a sealed element. (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) an epoxy resin molding compound for sealing containing red phosphorus coated with zinc oxide and a thermosetting resin as essential components, and this epoxy resin for sealing An electronic component device having an element sealed with a molding material. |