| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2cb72657cf0479385a9b5e655af1e16f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2081-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14655 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K105-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K503-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K105-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K81-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L31-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L9-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L81-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-02 |
| filingDate |
2001-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_026ccb872f70d3faa297ab70fb28a9f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41a53f723f057724f95410156cb6b10c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_590377c91cd1e46fc01b10e4e00338a8 |
| publicationDate |
2002-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002301737-A |
| titleOfInvention |
Method of manufacturing metal insert resin molded article and semiconductor device |
| abstract |
PROBLEM TO BE SOLVED: To provide a metal insert polyphenylene sulfide (PPS) resin excellent in heat resistance, general physical properties, etc., by integrally holding a metal member such as a metal terminal for a lead frame with good adhesion to a resin. Provided are a method for manufacturing a molded body, a molded body, and a semiconductor device having the same. SOLUTION: A metal member previously surface-treated with silver is referred to as P A method for producing a metal insert resin molded article insert-molded with a PS resin molding material, a metal insert resin molded article produced by this method, and a semiconductor device having the molded article. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020175389-A1 |
| priorityDate |
2001-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |