http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002299209-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
filingDate 2001-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4464638e7e10ef378cb851ee455b6e6f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_157f7fa1b23c26a1c0e002f962b3768f
publicationDate 2002-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002299209-A
titleOfInvention Exposure equipment
abstract (57) Abstract: Provided is an exposure apparatus used in a lithography step for a compound semiconductor wafer, wherein the wafer is less likely to crack even when the compound semiconductor wafer comes into contact with a mask. A mask holder (13) for holding a mask (M) and a wafer holder (12) for holding a compound semiconductor wafer (W) are provided. In order to buffer the pressing force of the mask M against the compound semiconductor wafer W when the mask M comes into contact with the compound semiconductor wafer W, the compound semiconductor wafer W is transferred via the rubber sheet 15 as an elastic member serving as a buffer member. The wafer is held by the wafer holding unit 12.
priorityDate 2001-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 22.