http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002298310-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_930d026de3a6f8109fa00a85852fe8e4 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L43-08 |
filingDate | 2001-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0618f234ffc26ee38b410e32dc06ee50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ebc32797084b3c15ec58b780d8994423 |
publicationDate | 2002-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2002298310-A |
titleOfInvention | Thin film magnetic head and method of manufacturing the same |
abstract | (57) [Problem] In a conventional thin-film magnetic head, NiP is used as a gap layer, and this is plated by an electroplating method using a direct current, but in this case, an element near an interface is formed. The P content was reduced, and it was not possible to improve the corrosion resistance and smoothness of the gap layer, and to promote the demagnetization of the gap layer. SOLUTION: A seed layer 31 made of, for example, Cu is formed on a lower magnetic pole layer 21 by plating. Is formed by plating. This makes it difficult for the gap layer 22 to lattice-match with the gap layer 22. Can increase the content of element P near the interface of The corrosion resistance and smoothness of the gap layer 22 can be improved, and the gap layer 22 can be appropriately demagnetized. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100429698-C http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7359148-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014072829-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7265942-B2 |
priorityDate | 2001-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.