http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002298310-A

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L43-08
filingDate 2001-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0618f234ffc26ee38b410e32dc06ee50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ebc32797084b3c15ec58b780d8994423
publicationDate 2002-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002298310-A
titleOfInvention Thin film magnetic head and method of manufacturing the same
abstract (57) [Problem] In a conventional thin-film magnetic head, NiP is used as a gap layer, and this is plated by an electroplating method using a direct current, but in this case, an element near an interface is formed. The P content was reduced, and it was not possible to improve the corrosion resistance and smoothness of the gap layer, and to promote the demagnetization of the gap layer. SOLUTION: A seed layer 31 made of, for example, Cu is formed on a lower magnetic pole layer 21 by plating. Is formed by plating. This makes it difficult for the gap layer 22 to lattice-match with the gap layer 22. Can increase the content of element P near the interface of The corrosion resistance and smoothness of the gap layer 22 can be improved, and the gap layer 22 can be appropriately demagnetized.
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priorityDate 2001-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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