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publicationDate 2002-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002293887-A
titleOfInvention Insulating resin composition for printed wiring board and its use
abstract PROBLEM TO BE SOLVED: To provide a halogen-free insulating resin sheet excellent in copper foil peeling strength and chemical resistance. SOLUTION: Epoxy resin, phenolic curing agent, dihydrobenzoxazine An epoxy resin composition comprising a compound having a ring, a polyvinyl butyral resin and an inorganic filler, wherein the epoxy resin composition contains a polyphenol-based antioxidant, and a method for producing a printed wiring board using the same. is there.
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