abstract |
PROBLEM TO BE SOLVED: To provide a halogen-free insulating resin sheet excellent in copper foil peeling strength and chemical resistance. SOLUTION: Epoxy resin, phenolic curing agent, dihydrobenzoxazine An epoxy resin composition comprising a compound having a ring, a polyvinyl butyral resin and an inorganic filler, wherein the epoxy resin composition contains a polyphenol-based antioxidant, and a method for producing a printed wiring board using the same. is there. |