http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002284847-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate | 2001-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19a201f9380f5847473dafda884d2d86 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b67d35fd6aa0a02f7318fec0201dfb5c |
| publicationDate | 2002-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002284847-A |
| titleOfInvention | Epoxy resin composition and cured product thereof |
| abstract | (57) [Problem] To provide an insulating material for electric and electronic parts (such as a highly reliable semiconductor encapsulating material) and a laminated board (printed wiring board) having excellent fluidity and excellent heat resistance in a cured product. , Build-up board, etc.) and various composite materials including CFRP, To provide useful materials for adhesives, paints, etc. An epoxy resin having a conjugated diene group and / or Alternatively, an epoxy resin composition containing an epoxy resin curing agent and a compound having an unsaturated group adjacent to a ketone group as essential components is prepared, and the composition is cured. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104163817-A |
| priorityDate | 2001-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 110.