http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002280740-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2001-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d5247cbe7d2dd33a8c6412914b6a56b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eda33f0f473d3590f86a61a4a81271d1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_772dfed386c7c0d8a559bd366438f64a |
| publicationDate | 2002-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002280740-A |
| titleOfInvention | Multilayer printed wiring board |
| abstract | (57) [Summary] [PROBLEMS] To reduce the wiring distance of a conductor circuit, to increase the degree of freedom in designing the conductor circuit, and to reduce the possibility of cracks in the interlayer resin insulation layer near the via hole, thereby improving reliability. Provide excellent printed wiring boards. SOLUTION: A multilayer printed wiring board in which a conductor circuit and an interlayer resin insulating layer are sequentially laminated on a substrate, and the conductor circuits are connected via via holes and through holes, wherein the through holes are formed in an outer layer A coaxial through hole comprising a through hole and an inner layer through hole formed inside the outer layer through hole, wherein the via hole is At least one of the via holes is formed so as to have a stacked via structure, and at least one of the via holes has a land diameter which is enlarged in a conductive circuit non-forming region formed around the via hole of the stacked via structure. Has been A multilayer printed wiring board, wherein the via hole having the stacked via structure is stacked on a land of the inner layer through hole. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008523627-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11582867-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007027451-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020521949-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011233836-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11102882-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015038909-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011135900-A1 |
| priorityDate | 2001-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 59.