| abstract |
(57) [Summary] [Problem] To provide a bag for semiconductor moisture-proof packaging which is less reduced in barrier properties against water vapor and oxygen due to handling such as bag making processing, and which is lighter without impairing practical strength. SOLUTION: In a semiconductor moisture-proof packaging bag composed of a laminated film formed by laminating a base film, a barrier layer, and a heat sealing layer, the barrier layer is stretched by elongation = Aluminum foil of 3% or more. |