| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08 |
| filingDate |
2001-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f451511b12b30df228a7eb54ff6a95cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_002f3e06d2ac22a65d6c1bd0c0b0b986 |
| publicationDate |
2002-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002265894-A |
| titleOfInvention |
Heat-resistant adhesive sheet, metal foil-clad laminate and wiring board for area array semiconductor package |
| abstract |
(57) [Summary] [Problem] A base material which suppresses the exudation of an adhesive on a warp preventing surface without impairing heat resistance and moisture absorption reflow property of an adhesive sheet and without hindering a manufacturing process. A heat-resistant adhesive sheet having excellent adhesion between a metal foil and a metal foil, and a metal foil-clad laminate and a wiring board for an area array semiconductor package using the same. SOLUTION: A heat-resistant adhesive composition having a B-stage heat-resistant adhesive composition on one surface of a base material and containing a polyamideimide resin and an epoxy resin and a phenol resin as thermosetting resin components on the other surface. A heat-resistant adhesive sheet comprising: |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013136752-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I424591-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2109156-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011087044-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014518789-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5766125-B2 |
| priorityDate |
2001-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |