| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-20 |
| filingDate |
2001-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43f83ebd2e089814eca7bbad9f1fb8a8 |
| publicationDate |
2002-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002265571-A |
| titleOfInvention |
Epoxy resin composition and semiconductor device |
| abstract |
(57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation having characteristics excellent in fluidity and eventually in package filling. SOLUTION: (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler, and (E) an unsaturated fatty acid having 18 to 26 carbon atoms having one double bond. An epoxy resin composition for semiconductor encapsulation comprising an amide compound as an essential component. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018181601-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018181601-A1 |
| priorityDate |
2001-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |