http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002261196-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_242cc8d15c771395b920cc7de452da6a |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8592 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48137 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 |
| filingDate | 2001-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11c19434c555d7db51388f60bd481c0e |
| publicationDate | 2002-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002261196-A |
| titleOfInvention | Device package |
| abstract | (57) [PROBLEM] To provide an element package in which a first element and a second element are supported on a lead frame and fixed in a molding material. Suppress. An element package includes a lead frame. 2. a first bonding wire 10 for electrically connecting the first element 4 and the second element 9; a die bonding agent 8B for connecting the second element 9 to the lead frame 12; A second bonding wire 11 for electrically connecting to the lead frame 12, an element coating mold material 3 formed so as to cover at least the first element 4, and an element coating mold material 3, the second element 9, There is provided a package forming mold material 2 which covers the bonding wires 10 and 11 and the lead frame 12 and forms the external appearance of the package. The linear thermal expansion coefficient of the molding material 3 is between the linear thermal expansion coefficient of the contact surface 4 b of the first element 4 with the molding material 3 and the linear thermal expansion coefficient of the molding material 2. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1443331-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017023238-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009070894-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111586972-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107548573-A |
| priorityDate | 2001-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.