abstract |
(57) [Summary] [PROBLEMS] To realize highly reliable flip chip mounting by improving the accuracy of the position and shape dimensions of bumps. SOLUTION: In the semiconductor device of this embodiment, a bump 14 having a two-stage cylindrical or convex cross section is provided on an electrode pad 12 formed on a main surface of a semiconductor chip 10. That is, the bump 14 is formed in a cylindrical pedestal portion 14. a and a cylindrical tail portion 14b smaller in diameter than the pedestal portion 14a Consists of The top surface (bump top surface) of the tail portion 14b and the top surface of the pedestal portion 14a are respectively flat. The bumps 14 are formed by, for example, gold plating using a resist (photolithography) technique and a plating technique. |