| abstract |
(57) [Summary] [PROBLEMS] A flexible printed circuit board that eliminates poor appearance due to agglomeration of filler particles and non-uniformity due to sedimentation, and that does not cause bubbles or adhesive repelling during adhesive application. Provided is a suitable slippery polyimide film and a method for producing the same. SOLUTION: This is a film obtained by forming a polyamic acid solution containing filler particles and imidizing the film, wherein the film surface roughness Rmax is less than 2 μm, and the static friction coefficient between the film surfaces is 0.1 to 1.2. Some slippery polyimide films. |