http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002252218-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-323
filingDate 2001-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98a655836ce60fa5d6d583f80a15619d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c104e37a23970f07cbc95dba9cfb9a00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6817dc1ebd3306a6f613193bbfd9b5a0
publicationDate 2002-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002252218-A
titleOfInvention Etching solution for compound semiconductor film, etching method using the same, and method for recovering iodine from waste etching solution
abstract An object of the present invention is to provide an etchant for a compound semiconductor film having excellent selectivity, an etching method using the same, and a method for recovering iodine from the etching waste liquid. An etchant for selectively etching an Al x Ga 1-x As (0.4 ≦ x ≦ 1) layer, wherein the etchant is an aqueous hydrochloric acid solution containing an anion containing an iodine atom. It is used as a film etching solution.
priorityDate 2001-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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