| abstract |
(57) [Summary] (with correction) [PROBLEMS] To propose a method for manufacturing a multilayer printed wiring board incorporating a highly reliable semiconductor element. SOLUTION: The die pad 38 of the IC chip 20 is UV. After being placed in contact with the tape 40 and filled with the filler 41, the UV tape 40 is peeled off, and then a build-up layer is formed on the IC chip 20. Therefore, the IC chip and the via hole of the build-up layer can be appropriately electrically connected, and a highly reliable multilayer printed wiring board with a built-in semiconductor element can be manufactured. |