http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002246717-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| filingDate | 2001-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_351f498647df18a836e04a1a461086b8 |
| publicationDate | 2002-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002246717-A |
| titleOfInvention | Ceramic circuit board |
| abstract | (57) [Summary] [PROBLEMS] A metal circuit board bonded to both upper and lower surfaces of a ceramic substrate cannot be reliably and firmly electrically connected to each other. A metal circuit board made of copper or aluminum is attached to both surfaces of a ceramic substrate having a through hole so as to cover the through hole, and a metal pillar made of copper or aluminum is provided in the through hole. And let A ceramic circuit board in which metal circuit boards 3 on both sides of a ceramic substrate are connected by the metal pillars 5, wherein a space having a length of 30 μm to 200 μm is provided between the inner wall surface of the through hole 4 and the outer wall surface of the metal pillar 5. Was provided. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015170804-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115802596-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018006463-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2012067177-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017059831-A |
| priorityDate | 2001-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.