http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002246513-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73215 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4826 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 |
| filingDate | 2001-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a3af280f816f19d47c9a20fcf7ca04a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b310bf05eb2279a070a8d4e3be16990 |
| publicationDate | 2002-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002246513-A |
| titleOfInvention | Semiconductor device |
| abstract | (57) Abstract: A semiconductor chip and a lead frame or a substrate are bonded with a thermoplastic organic resin composition having a thermal softening temperature of 260 ° C. or more and a linear expansion coefficient at a reflow temperature of 100 ppm / ° C. or less. The glass transition temperature is 1 A semiconductor device sealed with a cured product of an epoxy resin composition to be a cured product at 50 ° C. or higher. According to the present invention, it is possible to obtain a semiconductor device having good heat resistance and small warpage in which no package crack occurs during reflow even when lead-free solder is used. |
| priorityDate | 2001-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 62.