| abstract |
(57) [Summary] [PROBLEMS] To provide excellent heat strength, adhesiveness to various members such as semiconductor elements and lead frames, soldering resistance at the time of board mounting, especially when the soldering temperature is higher than before. Excellent, An object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation, such as Ni, Ni-Pd, Ni-Pd-Au, which has excellent adhesion to a pre-plating frame. SOLUTION: (A) an epoxy resin, (B) a phenolic resin, (C) a silane compound having an amide bond and a carboxy group and / or a hydrolyzate of the silane compound, (D) An epoxy resin composition for semiconductor encapsulation, comprising an inorganic filler and (E) a curing accelerator as essential components. |