abstract |
(57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation which is excellent in fluidity during molding, solder resistance, and temperature cycle resistance. SOLUTION: An epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) a silicone rubber as essential components, comprises: Shore A hardness is 20 ~ 90. An epoxy resin composition for semiconductor encapsulation, which is 90. |