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filingDate 2001-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2002-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002241581-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation which is excellent in fluidity during molding, solder resistance, and temperature cycle resistance. SOLUTION: An epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) a silicone rubber as essential components, comprises: Shore A hardness is 20 ~ 90. An epoxy resin composition for semiconductor encapsulation, which is 90.
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