| abstract |
(57) [Problem] To provide a non-cleaning flux usable for lead-free solder and a solder composition containing the same. A flux for soldering containing an epoxy resin and an organic carboxylic acid, wherein the epoxy resin and the organic carboxylic acid have a carboxyl group of the organic carboxylic acid with respect to 1.0 equivalent of an epoxy group of the epoxy resin. The epoxy resin and the organic carboxylic acid are contained in a total amount of 70% by mass or more based on the total amount of the flux, and 70% by mass based on the total amount of the flux, if desired. % Soldering flux is used which further contains less than 10% alcohol. |