| abstract |
PROBLEM TO BE SOLVED: To provide a semiconductor package substrate which can be used for a small semiconductor package which is excellent in miniaturization, high density, prevents package cracks, and is excellent in reliability, a method of manufacturing the same, and a semiconductor package. The present invention provides a method for manufacturing the same, comprising at least a conductor pattern connected to a semiconductor chip and an insulating base material supporting the conductor pattern, wherein the insulating base material is located outside an area for mounting the semiconductor chip. A semiconductor package substrate having a blind hole which does not reach a surface on which a conductor pattern is formed, on a surface opposite to the conductor pattern of the material. |