| abstract |
(A): Organic solvent (B): Polymer in which a polymer compound having an acid labile group as a base resin is cross-linked by a cross-linking group having a C—O—C group Compound (C): a polymer compound containing an acid generator, wherein the base resin is represented by the formula (3), R is represented by the formula (4a), and R 8 and R 9 are different from each other. Chemically amplified positive resist material. Embedded image Embedded image The chemically amplified positive resist material of the present invention is sensitive to high energy rays, excellent in sensitivity, resolution, plasma etching resistance, and also excellent in heat resistance and reproducibility of the resist pattern. Further, the pattern is unlikely to be overhanging, and has excellent dimensional controllability. |