abstract |
(57) [Problem] To provide a photosensitive resin composition excellent in high resolution, high adhesion, high sensitivity, plating bath contamination and the like, and particularly suitable for a resist material and the like. SOLUTION: A binder polymer having a carboxy group, a photopolymerizable compound having a photopolymerizable ethylenically unsaturated group in a molecule, and two N, N-di (hydroxy) alkylaminophenyl rings as a photoinitiator A composition containing the amine compound and the triphenylimidazole dimer described above. |