http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002232138-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d93502a23a72b56472bc75854cfe7c60 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
filingDate | 2001-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ecab81cbdbd0dbf3abe890b7ab9f500 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27d1f041b534e6a26eac121bddecb3f0 |
publicationDate | 2002-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2002232138-A |
titleOfInvention | Method for manufacturing multilayer circuit board |
abstract | (57) [Problem] To provide a method of manufacturing a multilayer circuit board having high adhesion between an electric insulating layer and a conductor layer and excellent in patternability. SOLUTION: The surface of an electric insulating layer formed by curing a curable resin composition containing an alicyclic olefin polymer or an aromatic polyether polymer is previously heated to 50 to 250 ° C. while maintaining the temperature. Provided is a method for manufacturing a multilayer circuit board, comprising forming a conductor layer by contacting with a plasma, followed by dry plating, and then wet plating or dry plating. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10586322-B2 |
priorityDate | 2001-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 157.