| abstract |
(57) Abstract: The dielectric-forming composition according to the present invention comprises 5 By heating at 00 ° C. or less, it is possible to form a dielectric material having a dielectric constant of 30 or more and a dielectric loss tangent of 0.1 or less, and part or all of the surface of the inorganic particles having a dielectric constant of 30 or more. It is characterized by comprising a composite particle for a dielectric coated with a conductive metal or a compound thereof or a conductive organic compound or a conductive inorganic substance, and a resin component comprising at least one of a polymerizable compound and a polymer. I have. With the use of the composite particles for a dielectric of the present invention, a dielectric layer having a low dielectric tangent of 0.1 or less and a high dielectric constant of 30 or more is formed at a low heating temperature of 500 ° C. or less as described above. can do. |