| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J131-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
| filingDate |
2001-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c815fe038d4139c7ee1f421780f235ce |
| publicationDate |
2002-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002226804-A |
| titleOfInvention |
Adhesive sheet for processing semiconductor substrates |
| abstract |
(57) [Problem] To provide an adhesive sheet for processing a semiconductor wafer, which is less impure and has excellent chipping resistance and prevents chip fly during dicing when processing a semiconductor wafer. SOLUTION: 100 parts by weight of a base resin is provided on a surface of a film substrate having transparency to ultraviolet rays and / or electron beams; An adhesive layer composed of 30 to 90 parts by weight of a radiation polymerizable compound, 0.05 to 20 parts by weight of a radiation polymerizable polymerization initiator, 2 to 12 parts by weight of a crosslinking agent, and 0.05 to 10 parts by weight of a conductive polymer is applied. Pressure sensitive adhesive sheet for processing semiconductor substrates. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4656888-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010047755-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005072575-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007035750-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015151453-A |
| priorityDate |
2001-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |